Astm b571 pdf free download

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The pre pressu ssure re shall be sufficient to burnish the coating at each stroke but not so great as to dig into it. Blisters, lifting, or peeling should not develop. Generally, thick deposits cannot be evaluated satisfactorily. File Test Test 7. Lifting or peeling is evidence of unsatisfactory adhesion. Chisel-Knife Test Test 5. Alternativel Alternatively y the chisel may be placed in back of an overhang area of the coating or at a coatingsubstrate interface exposed by sectioning the article with a saw.

A kn knif ifee ma may y be su subs bstit titut uted ed fo forr th thee ch chis isel el wi with th or wi with thou outt hammer ham mering ing or ligh lightt tap tappin ping. If it is pos possib sible le to rem remove ove the deposit, the adhesion is not satisfactory.

Soft or thin coatings cannot be evaluated for adhesion by this method. Grind-Saw Test Test 8. A ha hack ck saw may be su subs bstit titut uted ed fo forr th thee wheel wh eel,, ma maki king ng su sure re to saw in th thee di dire recti ction on th that at ten tends ds to 6. Draw Test Test 6. Electroplate Review w, Electroplaters rs Soc. Vol Vol 22, , p. Electroplaters Soc.

A quantitative analysis of the factors involved has been published. Push Test Test 9. Supporting the material on a ring about 2. Coatings and substrates that are sensitive to oxidation should be heated in an inert or reducing atmosphere or a suitable liquid. Then quen qu ench ch th thee pa part rt in wa wate terr or ot othe herr su suita itabl blee liq liqui uid d at ro room om temperature. Blis Blisters ters may eru erupt pt dur during ing the hea heatt and quench que nch tes testt whe when n plat plating ing sol solutio ution n is ent entrap rapped ped in sub substra strate te surface pits or pores which are bridged by the deposit.

If the deposited coating cannot be peeled or lifted from the substrate in an area adjacent to the blister s , the appearance of blisters should not be interpreted as evidence of inferior adhesion. In sc scri ribi bing ng th thee lin lines, es, us usee sufficient pressure to cut through the coating to the substrate in a single stroke.

If any portion of coating between the lines breaks away from the substrate, the adhesion is inadequate. In some cases, a brittle layer may be created by the materials involved causing peeling as a result of fracture rather than poor adhesion. This woul wo uld d no nott gi give ve a co corr rrec ectt in indi dica catio tion n of th thee as as-p -plat lated ed bo bond nd strength.

Make sure that any loose coating particles from scribing do not remain. Th Thee adhesion is not adequate if the tape has deposit adhering to it that comes from the area between the scribed lines.

Deposit continuous to the scribed lines is not considered. The tap tapee sha shall ll be wid widee enough to cover three or more parallel lines of the scribed area. Impac Impactt Test Test The severity of the test may be altered by changing the load and diameter of the ball. Exfoliation or blis blister terss in and around around ind indent entatio ations ns are evi eviden dence ce of inadequate adhesion. Soft and ductile coatings are generally not suited for evaluation.

Test-Coating Systems Peel Test Test Adhesive-backed tape may be considered as a possible alternative. Heat curing of the adhesive may be used, keeping in mind considerations noted in 9. The 9. Fo Forr reproducible results, the rate of pull, the thickness and width of the strip, and deposit thickness must be standardized. Pre Precisi cision on and Bias Keyw Keywords ords Users of this standard are expressly advised that determination of the validity of any such patent rights, and the risk of infringement of such rights, are entirely their own responsibility.

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It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. If more than one test is used, failure to pass any one test is considered unsatisfactory. In many instances, the end use of the coated article or its method of fabrication will suggest the technique that best represents functional requirements. For example, an article that is to be subsequently formed would suggest a draw or a bend test; an article that is to be soldered or otherwise exposed to heat would suggest a heat-quench test.

If a part requires baking or heat treating after plating, adhesion tests should be carried out after such posttreatment as well. These limitations are noted generally in the test descriptions and are summarized in Table 1 for certain metallic coatings.

Such adhesion is usually obtained if good electroplating practices are followed. This may be prying, hammering, bending, beating, heating, sawing, grinding, pulling, scribing, chiseling, or a combination of such treatments. If the coating peels, flakes, or lifts from the substrate, the adhesion is less than perfect. These tests have varying degrees of severity; and one might serve to distinguish between satisfactory and unsatisfactory adhesion in a specific application. The choice for each situation must be determined.

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Prohibited Uses. Detection of Prohibited Uses. Delivery Formats and Service. Originally published as B пїЅ Last previous edition B пїЅ 91 A hack saw may be substituted for the wheel, making sure to saw in the direction that tends to separate the coating from the substrate. Lifting or peeling is evidence of unsatisfactory adhesion. Blisters, lifting, or peeling should not develop.

Generally, thick deposits cannot be evaluated satisfactorily. Chisel-Knife Test 5. Alternatively the chisel may be placed in back of an overhang area of the coating or at a coatingsubstrate interface exposed by sectioning the article with a saw.

A knife may be substituted for the chisel with or without hammering or light tapping. If it is possible to remove the deposit, the adhesion is not satisfactory. Soft or thin coatings cannot be evaluated for adhesion by this method. Heat-Quench Test 9. Coatings and substrates that are sensitive to oxidation should be heated in an inert or reducing atmosphere or a suitable liquid.

Then quench the part in water or other suitable liquid at room temperature. Blisters may erupt during the heat and quench test when plating solution is entrapped in substrate surface pits or pores which are bridged by the deposit. If the deposited coating cannot be peeled or lifted from the substrate in an area adjacent to the blister s , the appearance of blisters should not be interpreted as evidence of inferior adhesion.

In some cases, a brittle layer may be created by the materials involved causing peeling due to fracture rather than poor adhesion. This would not give a correct indication of the as-plated bond strength.

Draw Test 6. The adhesion of the coating may be observed directly or evaluated further by techniques described in Section 5 for detachment from the substrate. If there is peeling or flaking of the coating or if it can be detached, the adhesion is not satisfactory.

File Test 7. Impact Test The severity of the test may be altered by changing the load and diameter of the ball. Exfoliation or blisters in and around indentations are evidence of inadequate adhesion. Soft and ductile coatings are generally not suited for evaluation. Grind-Saw Test 8.

Electroplaters Soc. Vol 22, , p. In scribing the lines, use sufficient pressure to cut through the coating to the substrate in a single stroke. If any portion of coating between the lines breaks away from the substrate, the adhesion is inadequate.

Make sure that any loose coating particles from scribing do not remain. The adhesion is not adequate if the tape has deposit adhering to it that comes from the area between the scribed lines.

Deposit continuous to the scribed lines is not considered. The tape shall be wide enough to cover three or more parallel lines of the scribed area. Peel Test Adhesive-backed tape may be considered as a possible alternative. Heat curing of the adhesive may be employed, keeping in mind considerations noted in 9. For reproducible results, the rate of pull, the thickness and width of the strip, and deposit thickness must be standardized.

A quantitative analysis of the factors involved has been published. Push Test Supporting the material on a ring about 2. Test-Coating Systems Scribe-Grid Test Precision and Bias The American Society for Testing and Materials takes no position respecting the validity of any patent rights asserted in connection with any item mentioned in this standard.

Users of this standard are expressly advised that determination of the validity of any such patent rights, and the risk of infringement of such rights, are entirely their own responsibility.